Ultrafast Processing of Zirconia Ceramics by Transient And Selective Laser Absorption
Ultrashort-pulse lasers (USPLs) are used in the machining of zirconia ceramics (ZrO2) because of their extremely high peak intensities. However, highly efficient and high precision microprocessing of ZrO2 remains challenging. In this study, we applied a transient and selective laser (TSL) processing technique by combining a USPL and a continuous-wave (CW) laser to realize ultrafast drilling of opaque ZrO2. Ultra-high-efficiency TSL drilling of ZrO2 was achieved with a processing efficiency 1800 times higher than that of USPL drilling. The material removal mechanism, hole formation process, and parameter dependence of TSL drilling were revealed by direct observation of the internal processing phenomenon on a timescale of microseconds. The variations in the processed surface characteristics, including surface morphology, elemental composition, and phase composition, are also presented. Subsequently, the effect of different excited electron regions occurring in the picosecond timescale induced by the USPL on the TSL drilling performance is discussed. Finally, the repeatability and stability of the TSL processing were verified by fabricating microarrays of different sizes. This study will contribute to revealing the ultrafast processing mechanisms of TSL processing in ZrO2 microfabrication. Furthermore, this technique can significantly broaden the applications of ZrO2 in the advanced electronic industry by greatly improving the microprocessing efficiency.
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